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INNOVATIVE SEMI SOLUTIONS
PLASMATHERM
Wafer processing platforms for standard and advanced processes used in microelectronics manufacturing. From etch and deposition applications to rapid thermal processing and plasma dicing, our systems keep pace with your needs and are engineered to provide outstanding performance time after time
SHELLBACK
- 200mm, 150/200mm or 300mm configurations
- Dry In – Dry Out
- SMIF, FOUP, Cassette, OHT
- Etch, Resist Strip, Clean
- Purpose built for FEOL & BEOL applications
- Acid, Solvents, Ozone
- Sustainability
- Enhanced Update with predictive maintenance
RION PARTICLE COUNTER
Detection efficiency is increased to 10% (other models are <1%)
Particle size range 0.05~0.2um, 10ch
Color LCD, Touch panel with password protected configuration screen
Built-in thermal printer
Integrated CF card port for automatic data collection
Digital (RS-232) and Analog (4-20mA) outputs standard
Integrated clean air purge system for laser detection area
EV GROUP
EVG holds the dominant market share for all types of wafer bonding equipment and is a technology leader in lithography for advanced packaging and nanotechnology. Our metrology systems are optimized to ensure the tightest process control and highest yields for our industry-leading process equipment.
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