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Plasma Technology designed for maximum performance
Plasma-Therm is a leading provider of advanced processing equipment and solutions, specializing in semiconductor manufacturing.
At Plasma-Therm®, we do more than just offer you semiconductor and advanced packaging process equipment. We engage with you early to customize your systems and process technologies, so you get precisely the solutions you need.
Our history, process technology expertise and broad portfolio of etch, deposition, dicing and rapid thermal processing systems put you ahead of the pack, from R&D to high-volume manufacturing.
ALL TECHNOLOGIES
ETCH SYSTEMS
MODULAR DESIGNS FOR FLEXIBLE CONFIGURATION AND MATERIAL HANDLING TO MEET YOUR VARIED ETCH REQUIREMENTS
ICP
We add ICP to select reactive ion etch (RIE) systems to give you the right control needed for the application. Whether you need higher rates for productivity or a slow and controllable pace for critical processes, ICP has the capability.
EndpointWorks®
When you need reproducibility in a production environment, choose a system with integrated EndpointWorks, our endpoint program that works with laser interferometry, reflectance, optical emission spectroscopy, and other inputs.
IBE
When you need the technology of ion beam-driven processes with high-performance precision directional etching, coupled with long life and low-maintenance ion sources, then our IBE is ready. Whether the technology is on Plasma-Therm’s® QuaZar™ system or mated with our VERSALINE® system, the advanced motion controls, including tilt and rotation, provide the industry-leading solution.
DSE™
When etch depths for silicon are beyond a few microns and the greatest control is needed for sidewall smoothness, profile, and selectivity, then the deep reactive ion etching (DRIE)-configured VERSALINE® system featuring Plasma-Therm’s DSE™ is your system of choice.
